JPH0448040B2 - - Google Patents
Info
- Publication number
- JPH0448040B2 JPH0448040B2 JP59167943A JP16794384A JPH0448040B2 JP H0448040 B2 JPH0448040 B2 JP H0448040B2 JP 59167943 A JP59167943 A JP 59167943A JP 16794384 A JP16794384 A JP 16794384A JP H0448040 B2 JPH0448040 B2 JP H0448040B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric
- plates
- passive
- composite
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/092—Forming composite materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S310/00—Electrical generator or motor structure
- Y10S310/80—Piezoelectric polymers, e.g. PVDF
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S84/00—Music
- Y10S84/24—Piezoelectrical transducers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1059—Splitting sheet lamina in plane intermediate of faces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US523309 | 1983-08-15 | ||
US06/523,309 US4514247A (en) | 1983-08-15 | 1983-08-15 | Method for fabricating composite transducers |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6054600A JPS6054600A (ja) | 1985-03-29 |
JPH0448040B2 true JPH0448040B2 (en]) | 1992-08-05 |
Family
ID=24084482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59167943A Granted JPS6054600A (ja) | 1983-08-15 | 1984-08-13 | 複合電気トランスジユーサの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US4514247A (en]) |
EP (1) | EP0137529B1 (en]) |
JP (1) | JPS6054600A (en]) |
CA (1) | CA1225468A (en]) |
DE (1) | DE3483507D1 (en]) |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3409789A1 (de) * | 1984-03-16 | 1985-09-26 | Siemens AG, 1000 Berlin und 8000 München | Piezoelektrischer luft-ultraschallwandler mit breitbandcharakteristik |
DE3435569A1 (de) * | 1984-09-27 | 1986-04-10 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung einer array-ultraschall-antenne |
US4683161A (en) * | 1985-02-28 | 1987-07-28 | Piezo Electric Products, Inc. | Ceramic body with ordered pores |
US4640291A (en) * | 1985-06-27 | 1987-02-03 | North American Philips Corporation | Bi-plane phased array for ultrasound medical imaging |
US4671293A (en) * | 1985-10-15 | 1987-06-09 | North American Philips Corporation | Biplane phased array for ultrasonic medical imaging |
JPS62150610A (ja) * | 1985-12-25 | 1987-07-04 | 株式会社日立製作所 | 入力装置 |
US5319153A (en) * | 1986-04-28 | 1994-06-07 | Lawrence Fishman | Musical instrument transducer assembly having a piezoelectric sheet |
US5189771A (en) * | 1986-04-28 | 1993-03-02 | Lawrence Fishman | Method of making a musical instrument transducer |
US4774867A (en) * | 1986-04-28 | 1988-10-04 | Fishman Lawrence R | Musical instrument transducer |
US4727634A (en) * | 1986-04-28 | 1988-03-01 | Fishman Lawrence R | Musical instrument transducer |
US4768266A (en) * | 1986-08-29 | 1988-09-06 | Dataproducts Corporation | Method of making an ink jet printer transducer array |
US4801835A (en) * | 1986-10-06 | 1989-01-31 | Hitachi Medical Corp. | Ultrasonic probe using piezoelectric composite material |
US4864179A (en) * | 1986-10-10 | 1989-09-05 | Edo Corporation, Western Division | Two-dimensional piezoelectric transducer assembly |
US4728845A (en) * | 1987-06-30 | 1988-03-01 | The United States Of America As Represented By The Secretary Of The Navy | 1-3-0 Connectivity piezoelectric composite with void |
JPH01206575A (ja) * | 1988-02-15 | 1989-08-18 | Shin Etsu Polymer Co Ltd | 接着性熱融着形コネクタ |
US4939826A (en) * | 1988-03-04 | 1990-07-10 | Hewlett-Packard Company | Ultrasonic transducer arrays and methods for the fabrication thereof |
JP2794720B2 (ja) * | 1988-08-23 | 1998-09-10 | 松下電器産業株式会社 | 複合圧電振動子 |
FR2647904B2 (fr) * | 1989-02-02 | 1991-09-20 | Aerospatiale | Tete de controle par ultrasons |
GB8912782D0 (en) * | 1989-06-02 | 1989-07-19 | Udi Group Ltd | An acoustic transducer |
DE3928018A1 (de) * | 1989-08-24 | 1991-02-28 | Gruenzweig & Hartmann | Verfahren zur herstellung eines flaechenelementes zur absorption von elektromagnetischen wellen |
US5191687A (en) * | 1990-09-28 | 1993-03-09 | Caterpillar Inc. | Process for making piezoelectric stacks |
US5316000A (en) * | 1991-03-05 | 1994-05-31 | Technomed International (Societe Anonyme) | Use of at least one composite piezoelectric transducer in the manufacture of an ultrasonic therapy apparatus for applying therapy, in a body zone, in particular to concretions, to tissue, or to bones, of a living being and method of ultrasonic therapy |
FR2679125B1 (fr) * | 1991-07-19 | 1993-11-26 | Technomed International | Utilisation d'au moins un transducteur piezo-electrique composite pour la fabrication d'un appareil de therapie ultrasonique pour la therapie notamment de concretions, de tissus ou des os d'un etre vivant.. |
GB9105892D0 (en) * | 1991-03-20 | 1991-05-08 | Domino Printing Sciences Plc | Piezoelectric actuators |
US5329496A (en) * | 1992-10-16 | 1994-07-12 | Duke University | Two-dimensional array ultrasonic transducers |
US5744898A (en) * | 1992-05-14 | 1998-04-28 | Duke University | Ultrasound transducer array with transmitter/receiver integrated circuitry |
US5271133A (en) * | 1992-09-21 | 1993-12-21 | Caterpillar Inc. | Method for making a piezoelectric stack |
JP2976262B2 (ja) * | 1992-09-25 | 1999-11-10 | 株式会社村田製作所 | 電子部品の製造方法 |
JPH06132769A (ja) * | 1992-10-19 | 1994-05-13 | Murata Mfg Co Ltd | 圧電共振子及びその製造方法 |
US5359760A (en) * | 1993-04-16 | 1994-11-01 | The Curators Of The University Of Missouri On Behalf Of The University Of Missouri-Rolla | Method of manufacture of multiple-element piezoelectric transducer |
US5412854A (en) * | 1993-06-18 | 1995-05-09 | Humphrey Instruments, Inc. | Method of making a high frequency focused transducer |
US5539965A (en) * | 1994-06-22 | 1996-07-30 | Rutgers, The University Of New Jersey | Method for making piezoelectric composites |
US5615466A (en) * | 1994-06-22 | 1997-04-01 | Rutgers University | Mehtod for making piezoelectric composites |
US6225728B1 (en) | 1994-08-18 | 2001-05-01 | Agilent Technologies, Inc. | Composite piezoelectric transducer arrays with improved acoustical and electrical impedance |
JP3186603B2 (ja) * | 1996-09-06 | 2001-07-11 | 株式会社村田製作所 | 焦電型赤外線センサ素子 |
US5844349A (en) * | 1997-02-11 | 1998-12-01 | Tetrad Corporation | Composite autoclavable ultrasonic transducers and methods of making |
DE19743859C2 (de) * | 1997-10-04 | 2000-11-16 | Stn Atlas Elektronik Gmbh | Verfahren zur Herstellung eines Verbund-Ultraschallwandlers |
RU2133522C1 (ru) | 1997-11-03 | 1999-07-20 | Закрытое акционерное общество "Техно-ТМ" | Способ изготовления и контроля электронных компонентов |
US6183578B1 (en) | 1998-04-21 | 2001-02-06 | Penn State Research Foundation | Method for manufacture of high frequency ultrasound transducers |
JP3511929B2 (ja) * | 1999-01-25 | 2004-03-29 | 株式会社村田製作所 | 電子部品の製造方法、圧電共振部品の製造方法、電子部品及び圧電共振部品 |
US6390985B1 (en) * | 1999-07-21 | 2002-05-21 | Scimed Life Systems, Inc. | Impedance matching transducers |
US7288069B2 (en) | 2000-02-07 | 2007-10-30 | Kabushiki Kaisha Toshiba | Ultrasonic probe and method of manufacturing the same |
JP2001352769A (ja) * | 2000-04-05 | 2001-12-21 | Seiko Instruments Inc | 圧電アクチュエータの製造方法及び圧電アクチュエータ |
US6868594B2 (en) * | 2001-01-05 | 2005-03-22 | Koninklijke Philips Electronics, N.V. | Method for making a transducer |
JP3849976B2 (ja) * | 2001-01-25 | 2006-11-22 | 松下電器産業株式会社 | 複合圧電体と超音波診断装置用超音波探触子と超音波診断装置および複合圧電体の製造方法 |
CN1263173C (zh) * | 2001-12-06 | 2006-07-05 | 松下电器产业株式会社 | 复合压电体及其制造方法 |
US7157640B2 (en) * | 2003-06-17 | 2007-01-02 | Baggs Lloyd R | Undersaddle pickup for stringed musical instrument |
FR2858467B1 (fr) * | 2003-07-29 | 2008-08-01 | Thales Sa | Antenne sonar hf a structure composite 1-3 |
GB0402744D0 (en) * | 2004-02-07 | 2004-03-10 | Smiths Group Plc | Fluid-gauging probes |
US20060100522A1 (en) * | 2004-11-08 | 2006-05-11 | Scimed Life Systems, Inc. | Piezocomposite transducers |
US8288922B2 (en) * | 2006-06-30 | 2012-10-16 | The Penn State Research Foundation | Flexoelectric—piezoelectric composite based on flexoelectric charge separation |
US7791248B2 (en) * | 2006-06-30 | 2010-09-07 | The Penn State Research Foundation | Piezoelectric composite based on flexoelectric charge separation |
US7695784B2 (en) * | 2006-07-21 | 2010-04-13 | University Of Southern California | Post positioning for interdigital bonded composite |
DE602007003553D1 (de) * | 2007-01-30 | 2010-01-14 | Delphi Tech Inc | Herstellungsverfahren für einen piezoelektrischen Aktor |
EP1982968A1 (en) * | 2007-04-16 | 2008-10-22 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | A low-smoke pyrotechnic composition for producing colored flames |
US20090064476A1 (en) * | 2007-07-27 | 2009-03-12 | The Penn State Research Foundation | Piezoelectric materials based on flexoelectric charge separation and their fabrication |
US7804228B2 (en) * | 2007-12-18 | 2010-09-28 | Boston Scientific Scimed, Inc. | Composite passive materials for ultrasound transducers |
CN202940273U (zh) | 2009-07-27 | 2013-05-15 | Cts公司 | 封装的陶瓷元件 |
US8390594B2 (en) * | 2009-08-18 | 2013-03-05 | Immersion Corporation | Haptic feedback using composite piezoelectric actuator |
US8561270B2 (en) * | 2010-02-22 | 2013-10-22 | Cts Corporation | Composite ceramic structure and method of making the same |
DK2912789T3 (en) | 2012-10-26 | 2017-10-16 | Rensselaer Polytech Inst | ACOUSTIC-ELECTRICAL CHANNEL CONSTRUCTION AND OPERATION BY ADAPTIVE TRANSDUCER GROUPS |
US9821541B2 (en) | 2015-07-14 | 2017-11-21 | uBeam Inc. | Laminate material bonding |
US11701689B2 (en) * | 2018-07-31 | 2023-07-18 | Resonant Acoustics International Inc. | Ultrasonic transducer |
RU2710103C1 (ru) * | 2018-11-30 | 2019-12-24 | федеральное государственное автономное образовательное учреждение высшего образования "Южный федеральный университет" | Способ изготовления композитного чувствительного пьезоэлемента |
US11348563B2 (en) | 2019-03-20 | 2022-05-31 | Lloyd Baggs Innovations, Llc | Pickup saddles for stringed instruments utilizing interference fit |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2787520A (en) * | 1952-03-07 | 1957-04-02 | California Research Corp | Process for producing piezoelectric transducers |
US2928068A (en) * | 1952-03-25 | 1960-03-08 | Gen Electric | Compressional wave transducer and method of making the same |
GB789336A (en) * | 1954-12-27 | 1958-01-22 | Erie Resistor Corp | Method of making thin flat electroded ceramic elements |
US3070775A (en) * | 1959-10-16 | 1962-12-25 | Jr Daniel E Andrews | Electroacoustic piezoelectricpaste transducer |
JPS4837852B1 (en]) * | 1969-03-22 | 1973-11-14 | ||
US3543058A (en) * | 1969-11-10 | 1970-11-24 | Westinghouse Electric Corp | Piezoelectric transducer |
US3781955A (en) * | 1970-12-21 | 1974-01-01 | V Lavrinenko | Method of making a piezoelectric element |
US4122725A (en) * | 1976-06-16 | 1978-10-31 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Length mode piezoelectric ultrasonic transducer for inspection of solid objects |
JPS54105799A (en) * | 1978-02-07 | 1979-08-20 | Toshiba Corp | Compound piezo-electric unit and preparation |
JPS54120899A (en) * | 1978-03-10 | 1979-09-19 | Nippon Telegr & Teleph Corp <Ntt> | Macromolecule complex piezo material |
JPS5946433B2 (ja) * | 1978-03-10 | 1984-11-12 | 株式会社東芝 | 圧電性高分子複合体の製造方法 |
US4378721A (en) * | 1978-07-20 | 1983-04-05 | Kabushiki Kaisha Kawai Seisakusho | Pickup apparatus for an electric string type instrument |
JPS5568687A (en) * | 1978-11-17 | 1980-05-23 | Matsushita Electric Ind Co Ltd | Fabrication of composite piezo-electric ceramics |
US4233477A (en) * | 1979-01-31 | 1980-11-11 | The United States Of America As Represented By The Secretary Of The Navy | Flexible, shapeable, composite acoustic transducer |
US4227111A (en) * | 1979-03-28 | 1980-10-07 | The United States Of America As Represented By The Secretary Of The Navy | Flexible piezoelectric composite transducers |
DE3019478A1 (de) * | 1980-05-21 | 1981-11-26 | SIEMENS AG AAAAA, 1000 Berlin und 8000 München | Verfahren zum herstellen einer ultraschallwandleranordnung |
DE3021449A1 (de) * | 1980-06-06 | 1981-12-24 | Siemens AG, 1000 Berlin und 8000 München | Ultraschallwandleranordnung und verfahren zu seiner herstellung |
FR2485858B1 (fr) * | 1980-06-25 | 1986-04-11 | Commissariat Energie Atomique | Procede de fabrication de transducteurs ultrasonores de formes complexes et application a l'obtention de transducteurs annulaires |
US4412148A (en) * | 1981-04-24 | 1983-10-25 | The United States Of America As Represented By The Secretary Of The Navy | PZT Composite and a fabrication method thereof |
US4485321A (en) * | 1982-01-29 | 1984-11-27 | The United States Of America As Represented By The Secretary Of The Navy | Broad bandwidth composite transducers |
US4422003A (en) * | 1982-08-16 | 1983-12-20 | The United States Of America As Represented By The Secretary Of The Navy | Perforated PZT polymer composites |
-
1983
- 1983-08-15 US US06/523,309 patent/US4514247A/en not_active Expired - Fee Related
-
1984
- 1984-08-09 CA CA000460636A patent/CA1225468A/en not_active Expired
- 1984-08-13 EP EP84201162A patent/EP0137529B1/en not_active Expired - Lifetime
- 1984-08-13 DE DE8484201162T patent/DE3483507D1/de not_active Expired - Lifetime
- 1984-08-13 JP JP59167943A patent/JPS6054600A/ja active Granted
- 1984-10-01 US US06/640,737 patent/US4572981A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0137529B1 (en) | 1990-10-31 |
US4572981A (en) | 1986-02-25 |
US4514247A (en) | 1985-04-30 |
EP0137529A3 (en) | 1987-01-21 |
JPS6054600A (ja) | 1985-03-29 |
CA1225468A (en) | 1987-08-11 |
EP0137529A2 (en) | 1985-04-17 |
DE3483507D1 (de) | 1990-12-06 |
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